A: Quotation for photo etching is comprehensively calculated based on material type, material thickness, product dimensions, processing difficulty, order quantity, surface treatment requirements, packaging method and other factors.

A: The verticality of the etched hole sidewall is related to material thickness. Thinner materials achieve better verticality, while thicker materials will show tapering/beveled sidewalls.

A: Etching, commonly referred to as photochemical etching, is a process: after exposure, plate-making and development, the protective film in the area to be etched is removed. When exposed to chemical solution, the metal dissolves and corrodes, forming concave-convex or hollow-out profiles. Photo etching processing is a custom metal fabrication technology based on this principle.

A: Common metals for photo etching include stainless steel, copper, aluminum, titanium, molybdenum, Kovar alloy, etc. Different etchants are adopted for different metal materials.

A: Chemical photo etching is a chemical milling process. Compared with laser cutting, metal stamping, EDM and waterjet cutting, it features low R&D cost, high dimensional accuracy, capability of rapid mass production. Finished parts have smooth surfaces free of burrs, and the original material properties of metal remain unchanged.

A: The available material thickness for photo etching generally ranges from 0.01mm to 3mm. Thicker materials lead to higher processing cost. The sheet width is limited by equipment capacity: normally the sheet width ≤700mm and length ≤2m.

A: Also known as photochemical etching, the typical process flow: Engineering drawing → Material preparation → Screen printing → Exposure → Development → Etching → Stripping → Cleaning → Inspection → Packaging & Delivery.

A: Compared with stamping, photo etching sampling can be finished within 24 hours, and mass production takes 3–5 days. It greatly cuts down R&D time and mold fabrication cost vs stamping which requires hard tooling.

A: Photo etching requires no stamping dies, features short development cycle, high processing precision, burr-free parts and low deformation. It suits ultra-thin materials and complex patterns. Especially for micro-hole structures, precision meshes, code discs and similar products, photo etching outperforms traditional mechanical machining.

A: Photo etching is widely used in consumer electronics, automotive electronics, semiconductor equipment, medical devices, communication equipment, optical instruments, new energy equipment, aerospace, industrial automation and other industries. Many precision metal components are manufactured by photo etching.

A: Stamping forms parts by shearing with hard molds, suitable for mass production of simple structures. Photo etching uses chemical corrosion for forming and requires no stamping dies, so it can fabricate more sophisticated and delicate patterns. It shows obvious advantages for micro holes, ultra-thin sheets and special-shaped parts.

A: Laser cutting uses high-energy laser beam to cut metals and fits thicker materials. Photo etching is more suitable for thin metals and precision features. It creates no heat-affected zone and delivers more uniform, smooth edges, ideal for precision electronic components.

A: Photo etching removes metal by chemical corrosion instead of mechanical cutting, so there are no cutting burrs generated in conventional machining. This is a critical benefit for products requiring high cleanliness and high precision.

A: Normally, photo etching can reach a tolerance of ±0.005mm ~ ±0.03mm. The actual precision depends on material thickness, part structure, processing technology and equipment capability. For ultra-precision products, further precision improvement can be realized via process optimization.

A: Most photo etching manufacturers support OEM service. Custom production can be carried out according to customer drawings, brand specifications and technical requirements, with packaging and delivery complying with customer standards.